PRODUCTS & SERVICES
 
DIE PROCESSING CAPABILITY
 
 
DIE PRODUCT

 
Manufacturers Supplied

 
Die Processing Capability

 
Wafer Processing Capability

 

 

PACKAGING PRODUCT

 

 
 

PACKAGING & SCREENING SERVICES

 
Manufacturers Supplied

 

 

 

 





















































 

We provides the following capabilities which can be tailored to meet individual customer needs.

Quality Levels:

  • Commerical
  • Automotive
  • Industrial
  • Military
  • Space

Back Lapping:

  • 8" / 200mm wafer
  • 290, 370 and 480 microns +/-25 um
  • 4", 5" and 6" also available

Wafer Probe:

  • Ambient to 200 deg.C
  • Up to 8" / 200mm
  • Automatic handling
  • Actel approved FPGA programming

Wafer Sawing:

  • Up to 8" / 200mm
  • Dual and single spindle
  • Stepped and bevelled cut
  • Automatic handling
  • Single or part wafer flexibility

Visual Inspection:

  • MIL-STD-883 method 2010 cond. A or B
  • MIL-STD-750 method 2072 or 2073
  • Customer specification

Optional Lot Qualification to:

  • MIL-STD-883
  • MIL-PRF-38534
  • Customer specification

Shipping Formats:

  • Waffle trays
  • Gel-Pak®
  • Tape and reel / Surftape®
  • Sawn wafer on film
  • Wafer
 

Tel:

Fax:

E-mail:
+86 (10) 8261-3173

+86 (10) 8261-2532

sales@bdp-semi.com

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