We offers a range of services which can be tailored to meet individual customer needs.

Back Lapping:

• 8" / 200mm wafer
• 290, 370 and 480 um +/-25 um
• 4", 5" and 6" also available

Wafer Probe:

• Ambient to 200 deg.C
• Up to 8" / 200mm
• Automatic handling

Wafer Sawing:

• Up to 8" / 200mm
• Dual and single spindle
• Stepped and bevelled cut
• Automatic handling
• Single or part wafer flexibility

Die Offload to Waffle Trays:

• Wafer map or inked wafer
• Die orientation
• Automatic or manual handling

Bare Die Tape and Reel:

• Die sizes from 0.25mm to 10mm on a side
• Tape width 8mm to 24mm
• Reel sizes from 7" to 13"
• Surftape® from Tempo Electronics
• Pocket tape
• Fully automatic handling

Visual Inspection:

• MIL-STD-883 method 2010 cond. A or B
• MIL-STD-750 method 2072 or 2073
• Customer specification

Optional Lot Qualification to:

• MIL-STD-883
• MIL-PRF-38534
• Customer specification

Value Added Services:

• Die storage
• Inventory management
• Distribution

Pre-production Assembly Services:

• Prototype assembly
• Test
• For more information see Packaging & Screening Services