PRODUCTS & SERVICES
 
WHY USE DIE?
 
 
DIE PRODUCT

 

 

 
Why Use Die?

 

 

 

 
Cost

 

 

 
 

PACKAGING PRODUCT

 

 
 

PACKAGING & SCREENING SERVICES

 
Manufacturers Supplied

 

 

 

 


























 
Cost Advantages:

Lower Cost of Ownership

Most notable in high volume applications where density is required and high yield silicon is implemented. The lower cost of ownership takes into consideration substrate, assembly, system test, equipment utilization, rework and increased product value. In addition, the die product costs are typically lower than the package equivalent.

Improvements in ownership costs:

  • Higher levels of integration
  • Substrate size/cost
  • Assembly/manufacturing process
  • Time to market
  • Product value
  • Features per die area & weight

Source: Die Products Consortium

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 
 

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E-mail:
+86 (10) 8261-3173

+86 (10) 8261-2532

sales@bdp-semi.com

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