BDP Semiconductors Limited - Why Use Die?

PRODUCTS & SERVICES

WHY USE DIE?

	DIE PRODUCT
		Manufacturers Supplied

		Die Processing Capability

		Why Use Die?
		Overall
		Electical Performance
		Size
		Cost
		Integration
		Properties
		Reliability

	PACKAGING PRODUCT
		Manufacturers Supplied

		Packaging Type

	PACKAGING & SCREENING SERVICES
		Manufacturers Supplied

		Sub-Contract Services

		Package Outlines

		Screening Flows

		Device Marking

Electrical Performance Advantages:

Die Products improve electrical performance.

The lower inductance and capacitance of bare die is important in analog, RF and power applications. Signal propagation and power/ground distributions are also improved.
Shorter electrical length of wirebonds and solder bumps results in lower parasitic inductance.
Lower capacitance and and less distance between chips leads to improved rise times or lower strength drivers.

Source: Die Products Consortium

Tel:

Fax:

E-mail:

+86 (10) 8261-3173

+86 (10) 8261-2532

sales@bdp-semi.com