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 PRODUCTS & SERVICES |
 WHY USE DIE? |
DIE PRODUCT |
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Why Use Die? |
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Properties |
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PACKAGING PRODUCT |
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PACKAGING & SCREENING SERVICES |
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Properties Advantages:
Manufacturability With bumped die and flip chip processing, the assembly flows are streamlined by reducing the number of process steps. Source: Die Products Consortium
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Tel: |
+86 (10) 8261-3173 +86 (10) 8261-2532 sales@bdp-semi.com |
About BDP Copyright (c) 2010 BDP Semiconductors Limited. All rights Reserved. |
