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 PRODUCTS & SERVICES |
 WHY USE DIE? |
DIE PRODUCT |
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Why Use Die? |
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Reliability |
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PACKAGING PRODUCT |
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PACKAGING & SCREENING SERVICES |
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Reliability Advantages:
Reliability The reduced number of interconnects with die use leads to improved reliability. The typical package has three connection points vs. two for wire bonds and a single solder joint with flip chip. Source: Die Products Consortium
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Tel: |
+852 - 2360-2811 +852 - 2360-1866 sales@bdp-semi.com |
About BDP Copyright (c) 2010 BDP Semiconductors Limited. All rights Reserved. |
