PRODUCTS & SERVICES
 
HERMETIC PACKAGING TYPE
 
 

DIE PRODUCT

 

 

 

 

PACKAGING PRODUCT

 
Packaging Type

 
Hermetic
 

PACKAGING & SCREENING SERVICES

 
Manufacturers Supplied

 

 

 

 

 


















 

We supplies following hermetic packaging type product;

  • CERDIP - CERamic Dual In-line Package
  • CERPACK - CERamic PACKage
  • CPGA - Ceramic Pin Grid Array
  • CSOP - Ceramic Small Outline Package
  • LCC - Leadless Chip Carrier
  • LDCC - Leaded Chip Carriers
  • MCM - Multi-Chip Module (Hybrid)
  • SIDEBRAZE - Side-brazed Ceramic Package
  • SOSMP - Small Outline-Surface Mount Package
  • TO - Transistor Outline









 

 

 

 

 

 

 

 
 

Tel:

Fax:

E-mail:
+86 (10) 8261-3173

+86 (10) 8261-2532

sales@bdp-semi.com

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