PRODUCTS & SERVICES
 
SUB-CONTRACT SERVICES
 
 

DIE PRODUCT


 

 

 

 

PACKAGING PRODUCT


 

 

 

PACKAGING & SCREENING SERVICES


 

 

Sub-Contract Services

 

 

 

     




























 

We offers a range of sub-contract packaging, test and screening services. Our flexible factory is optimised for a 'pick and mix' approach to meet individual customer requirements.

We can perform single, one-off tests such a constant acceleration or temperature cycling or provide complete end-to-end process flows such as MIL-STD-883 method 5004.

We have a range of standard flows which span a wide range of quality requirements, from commercial to military level product. Customer defined flows are also routinely supported.

In many cases these services are combined with procurement of silicon on behalf of customers to provide a complete 'turn-key' solution.

Our processes include;

Assembly into hermetic packaging:

  • Eutectic / epoxy / polyimide die attach
  • Gold / aluminium wire bonding
  • Die shear test per MIL-STD-883 method 2019 for ICs
  • Bond strength test per MIL-STD-883 method 2011 ICs

Internal Visual Inspection:

  • Per MIL-STD-883 method 2010 condition A or B
  • Or customer requirement

Temperature Cycling:

  • Per MIL-STD-883 method 1010
  • Or customer requirement

Constant Acceleration (Centrifuge):

  • Per MIL-STD-883 method 2001 condition E
  • Or customer requirement

Fine and Gross Leak Testing:

  • Per MIL-STD-883 method 1014
  • Or customer requirement

Burn-In:

  • 160 hours @ 125 deg.C per MIL-STD-883 method 1015
  • Or customer requirement
  • Static, dynamic, semi-dynamic

Electrical testing:

  • -55 deg.C to +200 deg.C
  • Analog and digital
  • Memory and microcontroller
  • Programmable logic and ASIC

Characterisation:

  • Device serialization
  • Data-logging
  • Parametric distribution analysis

Qualification and Quality Conformance:

  • Electrical parameters
  • Mechanical package related tests
  • Die related life testing
  • Customer specified programmes

 

Tel:

Fax:

E-mail:

+852 - 2360-2811

+852 - 2360-1866

sales@bdp-semi.com

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